Fast plating involving: Copper (II) sulfate (5% CuSo4 in 1% H2SO4) and nail?

What happens to the nail?


What is the overall reaction equation?


What effects does the concentration have on the entire reaction?Fast plating involving: Copper (II) sulfate (5% CuSo4 in 1% H2SO4) and nail?
1) To plating the nail, we must place the solution of Copper Sulfate and Sulfate Acid in the beaker. Then, take a wire that already connect with battery or electric power in the middle of wire. Bind the nails to two end of the wire. Place the two nails in the beaker. Set the experiment as electrolysis. Turn on the power of electric. And wait until the copper of solution resurface the face of nail. The nail would be yellowness as the copper like.





2) anode : SO4^(-2) ----%26gt; SO4 + 2e ----%26gt; SO2 + O2 + 2e


**notice = SO4 not in ion is not stable


katode : Cu^(+2) + 2e ----%26gt; Cu (would be place on the face of nail)


Reaction : CuSO4 ----%26gt; Cu + SO





3) The concentration will be decreased